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WINDOW AND DOOR SYSTEM WITH THERMAL INSULATION

AC-77P PANEL DOORS

Details:
  • Frame/leaf depth: 77 mm
  • Filling panel thickness: 36 - 69 mm
  • Maximum leaf dimensions: 1300 x 2300 mm
  • Thermal insulation: UD = from 0,8 W/m2.K

Information for the manufacturer:

Drawings for the architect:

2000 Pa

RESISTANCE TO WIND LOAD

Uw = 0,9 W/(m2K)

HEAT TRANSFER COEFFICIENT

E1500

WATERPROOF

The panel door system is a proposition for the most demanding users. The doors can be used in both single-family and multi-family houses. The design of the panel doors is based on the three-chamber AC-77HI system, in which an innovative thermal break was used for the new doors. Thanks to it, the unfavorable effect of thermal stresses caused by temperature differences on the outer and inner surfaces of the door was eliminated. The doors are designed in such a way that it is possible to make the door leaf flush with the frame from the outside (the door leaf profile is invisible from the outside). Single-sided overlay panels available on the market are used as door filling. The possibility of using hidden hinges increases the aesthetics of the door finish.

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